Kuraray America Showcases Sustainable Barrier Packaging Innovation at the 2026 American Packaging Summit

Kuraray America, Inc. participated in the 2026 American Packaging Summit, hosted by Generis at the Westin Chicago Lombard from May 14–15, 2026.

As a Thought Leadership Partner, Kuraray America joined packaging industry leaders to discuss innovation, sustainability, and the future of high-performance barrier packaging.

During the event, Ryan Slopek, Staff Research Scientist, and Pablo Garcia, PhD, MBA, Market Development Manager, presented:

“Protect More, Waste Less: Kuraray’s 100 Years of Innovation in Sustainable Barrier Packaging.”

Their presentation highlighted how Kuraray’s advanced material technologies are helping address key packaging challenges by balancing environmental sustainability, functional performance, and total system cost.

Key topics included recyclable multilayer flexible packaging structures enabled by EVAL™ EVOH technology, extended product shelf life through advanced coextrusion and material design, repulpable and PFAS-free barrier paper solutions using PVOH-based coatings, and circular packaging systems supported by bio-based PLANTIC™ materials.

The presentation also emphasized Kuraray’s continued collaboration with global partners to develop next-generation, PFAS-free, recyclable, and high-barrier packaging innovations.

Kuraray America’s onsite team, including Ryan Slopek, Pablo Garcia, PhD, MBA, and Vitor Godoy, connected with attendees at Booth #27 throughout the summit.

Event Details
2026 American Packaging Summit
May 14–15, 2026
Westin Chicago Lombard, Chicago, IL
Booth #27