Kuraray America and Mica Corporation to Present PLANTIC™ EP Packaging Innovation at TAPPI Webinar

As part of TAPPI’s Webinar series, Kuraray America, Inc. (KAI) will present alongside Mica Corporation and discuss our four-year collaboration that highlights the strength, technical depth, and innovation behind PLANTIC™ EP extrusion lamination. 

️ Don’t miss out. Register today.️ REGISTER HERE. 

📅 Tuesday, August 25th, 2026
⏰ 11am CST-USA

Presentation 
“High-barrier Bio-based Resin and Water-based Primer Integration for Recyclable Packaging”

Presenters
David Chacon MBA CPP, Market Development & Technical Service at Kuraray America,
Yong Zheng, Technical Service & Business Development Director at Mica Corporation.

Presentation Overview:  
Testing and specifying primer technologies for PLANTIC™ EP extrusion lamination with multiple films, including Paper / PLANTIC™ / Primer / Film structures.

Through systematic testing, film surface analysis, pilot scale extrusion trials, primer screening, and ongoing validation, KAI & Mica have worked to support outcomes that matter across the flexible packaging value chain, including:

▪ TPS extrusion-coated paper structures that pass Western Michigan University repulpability standards
▪ Outstanding barrier performance that supports functionality and shelf life.
▪ Designed to feed directly into the paper recycling stream.
▪ Validated beyond the lab on real equipment, at meaningful line speeds, with industry-ready processing equipment

This presentation offers a preview of how material science, adhesion expertise, and long-term collaboration are helping expand what is possible in high-performance, bio-based flexible packaging


Don’t miss out and register today.️ CLICK HERE TO REGISTER.